Temperature control and chillers in oxidation diffusion process-工業冷水機製造商 LNEYA Taiwan

Temperaturregelung und Kältemaschinen im Oxidationsdiffusionsverfahren

The oxidation diffusion process is a key step in semiconductor manufacturing. It is mainly used to form precise oxide layers and doping, and has extremely strict requirements for temperature control. In this process, the chiller, as an important part of temperature control, needs to meet the following requirements:

High-precision Temperature Control: During the oxidation diffusion process, slight fluctuations in temperature will significantly affect the oxidation rate, oxide layer thickness and doping uniformity. The chiller needs to be able to provide a temperature control accuracy of ±0.1℃ to ±1℃ to ensure the stability and repeatability of the process.

Fast Response: The process may require rapid heating and cooling. The chiller needs to have the ability to respond quickly, reach the set temperature in a short time, and quickly adjust according to the process requirements to meet the requirements of the temperature curve.

Wide Temperature Range: The oxidation diffusion temperature is usually between 800°C and 1200°C. Although the chiller does not directly cool such a high temperature, it needs to be able to effectively cool the peripheral structure of the process equipment, such as the furnace shell, cooling water circulation system, etc., to maintain the safe operating temperature of the equipment.

Continuous and Stable Operation: Semiconductor manufacturing is a continuous batch production. The chiller needs to be able to operate 24 hours a day, provide continuous and stable cooling capacity, and ensure the continuity and reliability of the entire production process.

Corrosion-resistant Materials: Since corrosive gases (such as silane, phosphine, arsine, etc.) may be used in the process, the contact parts of the chiller need to use corrosion-resistant materials to extend the life of the equipment and avoid pollution.

High Energy Efficiency and Low Noise: Considering environmental protection and the comfort of the operating environment, the chiller should be designed with high energy efficiency and low noise, reduce energy consumption, and improve the quality of the production environment.

Intelligent Control and Monitoring: Integrate advanced control systems such as PLC or more advanced automation systems to achieve remote monitoring, fault alarm and data recording, which is convenient for process management and optimization.

In summary, the chiller in the oxidation diffusion process must not only have high-precision and fast-response temperature control capabilities, but also meet multiple requirements such as corrosion resistance, continuous and stable operation, and intelligent management to adapt to the high requirements and strict standards of semiconductor manufacturing.